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Your search returned 9 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing
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Year : 2002 Volume number : 25 Issue: 02 |
Thermomechanical Reliability Of Underfilled Bga Pakages
(Article)
Subject:
Delamination
,
Reliability
,
Solder Joint Reliability
,
Underfloor
Author:
James
Pyland
page:
100
-
106
Effects Of Substrate Design On Underfill Voiding Using The Low Cost. High Throughput Flip Chip Assembly Process And No-Flow Underfill Materials
(Article)
Subject:
Flip Chi P
,
Electronic Packaging
,
No-Flow Underfill
,
Underfill Processing
Author:
David
Milner
page:
107
-
112
Assembly Of Lead-Free Bumped Flip-Chip With No-Flow Underfills
(Article)
Subject:
Flip Chi P
,
Lead-Free Solder
,
Material Properties
,
No-Flow Underfill
Author:
Zhuquing
Zhang
page:
113
-
119
Optimized Desoak System For Ic Panel Test Handlers
(Article)
Subject:
Ic Test
,
Desoak
,
Test Handler
Author:
Andreas C
Pfahnl
page:
120
-
126
Stress Analysis And Design Optimization Of A Wafer-Level Csp By Fem Simulations And Experiments
(Article)
Subject:
Design Optimization
,
Fem Simulation
,
Reliability
,
Thermal Stresses
Author:
Sven
Rzepka
page:
127
-
137
Manufacturing Of Voltage Transformer Enhanced By 3-D Computer Simulation Tools
(Article)
Subject:
Automated
,
Pressure
,
Computer Aided Engineering
Author:
Robert
Sekula
page:
138
-
144
Growth Prediction Of Tin/Copper Intremetallics Formed Between 63/37 Sn/Pb And Osp Coated Copper Solder Pads For A Flip Chip Application
(Article)
Subject:
Diffusion
,
Flip Chi P
,
Reliability
,
Solder Joint Reliability
Author:
Carlo
Grilletto
page:
78
-
83
Solder Joint Reliability And Characteristics Of Deformation And Crack Growth Of Sn-Ag-Cu Versus Eutectic Sn-Pb On A Wlp In A Thermal Cycling Test
(Article)
Subject:
Solder Joint Reliability
,
Thermal Bend Test
,
Wafer Level Package
Author:
Deok-Hoon
Kim
page:
84
-
90
Effect Of The Plasma Cleaning Process On Plastic Ball Grid Array Package Assembly Reliability
(Article)
Subject:
Interface
,
Plasma
,
Pull-Off Tester Theory Of Operation
,
Temperature Plasma
Author:
Liyu (Steve)
Yang
page:
91
-
99
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